We were established with the vision to fulfil growing requirements of customers with products based on latest technology while maintaining highest standards of customer service, work ethics and integrity.
Koki was founded in 1964, and has been in the soldering industry for more that half a century. Backed with earned knowledge and expertise gathered over the past 50 years, Koki is proud expert in soldering processes and materials, providing high quality soldering products and services to the clients worldwide.
Among various substrates and components used in recent years, some plating types, conditions and materials can be in a degraded condition. The powerful wettability of S3X58-M500C-5 ensures good assembly even for oxidized substrates and degraded components.
Anti-pillow and powerful wetting solder paste S3X58-M500C-5Sn 3.0Ag 0.5Cu
Cleans off stubborn oxide films Among various substrates and components used in recent years, some plating types, conditions and materials can be in a degraded condition. The powerful wettability of S3X58-M500C-5 ensures good assembly even for oxidized substrates and degraded components.
Significantly reduces BGA solder defects The "head-in-pillow" defects in BGA assemblies are caused by warping of BGA packages or oxidation of bumps due to heat during reflow. By improving wetting speed and thermal tolerance of flux, the occurrence rate of such defects is significantly reduced, thereby improving first run rate. The EXPERT 10.6 product family offers a comprehensive selection of Hybrid and IR Underheaters to ensure ideal conditions for the different rework applications. MARTIN offers various options and tools for optimizationof each application.
Wave soldering flux with high cleaning performance of the pallet mask JS-E-15L
Further reduction of pallet cleaning time Masking pallets require cleaning after every use. With improved cleanability, a significant reduction in pallet mask maintenance time and higher usability was realized.
Tacky flux for halogen free application TF-M880R
High viscosity for consistent deposit shape TF-M880R maintains its high adhesive force for a long period of time. BGA and CSP components will be secured from moving around.
Improved melting during repair Conventional halogen-free products tend to cause solder defects, which is effectively eliminated by TF-M880R for its improved thermal resistance. TF-M880R withstands high temperature heating, and ensures molten solder contact and coalescence. Please contact your local partner for more information..
Anti iron tip erosion super low Ag flux cored wire solder S01X7Ca-72M Sn 0.1Ag 0.7Cu 0.03Co
Inhibits erosion of Fe plating Co added to S01X7Ca-72M forms a barrier layer at the iron tip surface, which inhibits erosion of the tip. S01X7Ca-72M significantly reduces wear of iron tips compared to regular lead-free solder.
Printing type adhesive JU-48P
Applicable to various printing patterns From large patterns to small patterns, a consistent stencil release property is achieved. JU-48P assures a high quality printing regardless of printing patterns.
Consistent printing Heat slump during continual printing is suppressed, resulting in improved post-printing shape retention. There is no fluctuation in the height of print deposits, achieving consistency in continual printing.
Halogen free wave soldering flux JS-EU-31
Hydrophobic residue prevents migration By adopting a special rosin, JS-EU-31 achieved excellent hydrophobicity compared to regular organic acid based flux. Long exposure to humid conditions does not result in moisture absorption, and thus high electrical reliability is maintained. Migration and discoloration are effectively prevented.
Excellent solder workability Poor solder wettability and poor flux fluidity have always been a concern of organic acid type flux. Improvements have been made on these factors in JS-EU-31, achieving excellent solder workability just like rosin type flux.