We were established with the vision to fulfil growing requirements of customers with products based on latest technology while maintaining highest standards of customer service, work ethics and integrity.
Base of 15 years of know how on manufacturing, SJIT provides world class solar metalization line.
Our technology development team is doing our best to supply the machinery that is easy to use and has high productivity along with high accuracy. We are responding to the demands of the quickly changing industries by working to hard based on the technology to manufacture the latest semiconductor and know-how.
We will always be up-to-date and advance image-wise. We will recompense by endlessly challenging in our studies and technology development.
No | Equipmenu | Remark |
---|---|---|
1 | Loader | |
2 | Screen Printer | |
3 | Inspection | Option |
4 | Dryer | |
5 | Buffer system | |
6 | Screen Printer | |
7 | Inspection | Option |
8 | Dryer | |
9 | Buffer & Flip system | |
10 | Screen Printer | |
11 | Inspection | |
12 | Buffer system | |
13 | Screen Printer | |
14 | Inspection | |
15 | Firing furmace |
30MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-14D
No | Equipmenu | Remark |
---|---|---|
1 | Loader | |
2 | Screen Printer | |
3 | Screen Printer with Exchange unit | |
4 | Inspection | Option |
5 | Dryer | |
6 | Buffer system | |
7 | Screen Printer | |
8 | Screen Printer with Exchange unit | |
9 | Inspection | Option |
10 | Dryer | |
11 | Buffer & Flip system | |
12 | Screen Printer | |
13 | Screen Printer with Exchange unit | |
14 | Inspection | |
15 | Buffer system | |
16 | Screen Printer | |
17 | Screen Printer with Exchange unit | |
18 | Inspection | |
19 | Firing furmace |
50MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-28D
No | Equipmenu | Remark |
---|---|---|
1 | Loader | |
2 | Screen Printer | |
3 | Dryer | |
4 | Unloader |
5MW FOR LABORATORY, R & D CENTER AND PILOT LINE POP(PRINT ON PRINT) SUPPLY(OPTION)
Item | Specifications | Remark |
---|---|---|
Model | SCSP14S, SCSP14D* | |
Substrate | 6 inch Square (156mmx156mm) ±0.5mm | |
Lane number | 1 Lane / Line | |
Throughput(TPT) | 1200 cells/hr (1400 cells/hr MAX) | |
Wafer flow height | 950mm ±15mm (The height is distance from floor to cell flow) | |
Up Time (%) | ≥ 96% | |
Breakage rate (%) | ≤ 0.3% | |
Wafer align accuracy | ±12.5um | |
FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
CONVEYOR UNIT
PRE-ALIGN UNIT
WORK TABLE UNIT
MASK UNIT
SQUEEGEE UNIT
BREAKAGE INSPECTION
Item | Specifications | Remark |
---|---|---|
Model | SCSP28S, SCSP28D* | |
Substrate | 6 inch Square (156mmx156mm) ±0.5mm | |
Lane number | 1 Lane / Line | |
Throughput(TPT) | 1200 cells/hr (1400 cells/hr MAX) | |
Wafer flow height | 950mm ±15mm (The height is distance from floor to cell flow) | |
Up Time (%) | ≥ 96% | |
Breakage rate (%) | ≤ 0.3% | |
Wafer align accuracy | ±12.5um | |
FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
SCREEN PRINTER (DUAL LANE)
EXCHANGE UNIT
SCREEN PRINTER (DUAL LANE)
Item | Specifications | Remark |
---|---|---|
Cassette (TRC) | 100 wafers/cassette Pitch & Row input system | |
MAX Cassette load | 5ea standard or Customer demand | |
Cassette Transfer | Motor & Inverter control | |
Buffer | Loading 10 wafers Unloading when cassette changing | |
Breakage inspection | 2M px. Detect Size, V-cut and chip. | |
Dispose of breakage wafers | Stack Reject box | |
Throughput(TPT) | 1400 cells/hr (Single lane) 2800 cells/hr (Dual lane) |
|
FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
CONVEYOR UNIT / PRE-ALIGN UNIT / WORK TABLE UNIT / MASK UNIT / SQUEEGEE UNIT / BREAKAGE INSPECTION
No | Equipmenu | Remark |
---|---|---|
1 | Loader | |
2 | Screen Printer | |
3 | Inspection | Option |
4 | Dryer | |
5 | Buffer system | |
6 | Screen Printer | |
7 | Inspection | Option |
8 | Dryer | |
9 | Buffer & Flip system | |
10 | Screen Printer | |
11 | Inspection | |
12 | Buffer system | |
13 | Screen Printer | |
14 | Inspection | |
15 | Firing furmace |
Breakage inspection Buffer unit Flip station (SCIF only) Divide unit (Dual lane only)
No | Equipmenu | Remark |
---|---|---|
Vision | 11M px. | |
NG control | Stop & Alarm, Display NG point | |
Wafer top surface Finger Grid inspection |
Finger grid cut Foreign substance Bus bar position, cut | |
Wafer bottom surface Bus Bar inspection | Bus bar position, cut Foreign substance | |
Wafer bottom surface BSF | Printing area Paste pore BSF Scratch | |
Throughput(TPT) | 1400 cells/hr (Single lane)2800 cells/hr (Dual lane) | |
FA | SECS/GEM Support (ex. SECS II, HSMS) | option |
Conveyor unit Pattern inspection Wafer turn unit (option)