Photovoltaic Equipment

We were established with the vision to fulfil growing requirements of customers with products based on latest technology while maintaining highest standards of customer service, work ethics and integrity.

Base of 15 years of know how on manufacturing, SJIT provides world class solar metalization line.

Our technology development team is doing our best to supply the machinery that is easy to use and has high productivity along with high accuracy. We are responding to the demands of the quickly changing industries by working to hard based on the technology to manufacture the latest semiconductor and know-how.

We will always be up-to-date and advance image-wise. We will recompense by endlessly challenging in our studies and technology development.

 

SCM-14S/SCM-14D

No Equipmenu Remark
1 Loader
2 Screen Printer
3 Inspection Option
4 Dryer
5 Buffer system
6 Screen Printer
7 Inspection Option
8 Dryer
9 Buffer & Flip system
10 Screen Printer
11 Inspection
12 Buffer system
13 Screen Printer
14 Inspection
15 Firing furmace

OVERVIEW

30MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-14D

SCM-28S/SCM-28D

No Equipmenu Remark
1 Loader
2 Screen Printer
3 Screen Printer with Exchange unit
4 Inspection Option
5 Dryer
6 Buffer system
7 Screen Printer
8 Screen Printer with Exchange unit
9 Inspection Option
10 Dryer
11 Buffer & Flip system
12 Screen Printer
13 Screen Printer with Exchange unit
14 Inspection
15 Buffer system
16 Screen Printer
17 Screen Printer with Exchange unit
18 Inspection
19 Firing furmace

OVERVIEW

50MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-28D

SCM-14RD

No Equipmenu Remark
1 Loader
2 Screen Printer
3 Dryer
4 Unloader

OVERVIEW

5MW FOR LABORATORY, R & D CENTER AND PILOT LINE POP(PRINT ON PRINT) SUPPLY(OPTION)

Screen Printer (SCSP-14S/SCSP-14D)

Item Specifications Remark
Model SCSP14S, SCSP14D*
Substrate 6 inch Square (156mmx156mm) ±0.5mm
Lane number 1 Lane / Line
Throughput(TPT) 1200 cells/hr (1400 cells/hr MAX)
Wafer flow height 950mm ±15mm (The height is distance from floor to cell flow)
Up Time (%) ≥ 96%
Breakage rate (%) ≤ 0.3%
Wafer align accuracy ±12.5um
FA SECS/GEM Support (ex. SECS II, HSMS) Option

OVERVIEW

CONVEYOR UNIT
PRE-ALIGN UNIT
WORK TABLE UNIT
MASK UNIT
SQUEEGEE UNIT
BREAKAGE INSPECTION

Screen Printer (SCSP-28S/SCSP-28D)

Item Specifications Remark
Model SCSP28S, SCSP28D*
Substrate 6 inch Square (156mmx156mm) ±0.5mm
Lane number 1 Lane / Line
Throughput(TPT) 1200 cells/hr (1400 cells/hr MAX)
Wafer flow height 950mm ±15mm (The height is distance from floor to cell flow)
Up Time (%) ≥ 96%
Breakage rate (%) ≤ 0.3%
Wafer align accuracy ±12.5um
FA SECS/GEM Support (ex. SECS II, HSMS) Option

OVERVIEW

SCREEN PRINTER (DUAL LANE)
EXCHANGE UNIT
SCREEN PRINTER (DUAL LANE)

Loading System

Item Specifications Remark
Cassette (TRC) 100 wafers/cassette Pitch & Row input system
MAX Cassette load 5ea standard or Customer demand
Cassette Transfer Motor & Inverter control
Buffer Loading 10 wafers Unloading when cassette changing
Breakage inspection 2M px. Detect Size, V-cut and chip.
Dispose of breakage wafers Stack Reject box
Throughput(TPT) 1400 cells/hr (Single lane)
2800 cells/hr (Dual lane)
FA SECS/GEM Support (ex. SECS II, HSMS) Option

OVERVIEW

CONVEYOR UNIT / PRE-ALIGN UNIT / WORK TABLE UNIT / MASK UNIT / SQUEEGEE UNIT / BREAKAGE INSPECTION

Buffer/Flip System

No Equipmenu Remark
1 Loader
2 Screen Printer
3 Inspection Option
4 Dryer
5 Buffer system
6 Screen Printer
7 Inspection Option
8 Dryer
9 Buffer & Flip system
10 Screen Printer
11 Inspection
12 Buffer system
13 Screen Printer
14 Inspection
15 Firing furmace

COMPOSITION

Breakage inspection Buffer unit Flip station (SCIF only) Divide unit (Dual lane only)

PATTERN INSPECTION SYSTEM (SCPI)

No Equipmenu Remark
Vision 11M px.  
NG control Stop & Alarm, Display NG point  
Wafer top surface
Finger Grid inspection
Finger grid cut Foreign substance Bus bar position, cut  
Wafer bottom surface Bus Bar inspection Bus bar position, cut Foreign substance  
Wafer bottom surface BSF Printing area Paste pore BSF Scratch  
Throughput(TPT) 1400 cells/hr (Single lane)2800 cells/hr (Dual lane)  
FA SECS/GEM Support (ex. SECS II, HSMS) option

COMPOSITION

Conveyor unit Pattern inspection Wafer turn unit (option)

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