- About Us
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Bergen Systems - The Company
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For over three decades, Bergen Systems has been setting standards for robust, innovative, and durable industrial solutions in India. Our devotion to engineering excellence is evident in our product portfolio. We bring equipment that are popular for their innovative and compact and efficient designs, superlative performance, high durability and cost effectiveness. Providing our clients with unparalleled customer support, equipment performance and reliability has been our endeavour right from the inception, and the sincerity of our efforts has brought us this far.
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- Products
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Bergen Systems - Products or Divisions
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PCB Assembly Equipment -
Factory Automation Equipment -
Photovoltaic Equipment -
Semi Conductor -
PCB Manufacturing Equipment -
Vision System
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- Events
- Location
- Career
- Contact
Photovoltaic Equipment
We were established with the vision to fulfil growing requirements of customers with products based on latest technology while maintaining highest standards of customer service, work ethics and integrity.
Base of 15 years of know how on manufacturing, SJIT provides world class solar metalization line.
Our technology development team is doing our best to supply the machinery that is easy to use and has high productivity along with high accuracy. We are responding to the demands of the quickly changing industries by working to hard based on the technology to manufacture the latest semiconductor and know-how.
We will always be up-to-date and advance image-wise. We will recompense by endlessly challenging in our studies and technology development.
SCM-14S/SCM-14D
| No | Equipmenu | Remark |
|---|---|---|
| 1 | Loader | |
| 2 | Screen Printer | |
| 3 | Inspection | Option |
| 4 | Dryer | |
| 5 | Buffer system | |
| 6 | Screen Printer | |
| 7 | Inspection | Option |
| 8 | Dryer | |
| 9 | Buffer & Flip system | |
| 10 | Screen Printer | |
| 11 | Inspection | |
| 12 | Buffer system | |
| 13 | Screen Printer | |
| 14 | Inspection | |
| 15 | Firing furmace |
OVERVIEW
30MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-14D
SCM-28S/SCM-28D
| No | Equipmenu | Remark |
|---|---|---|
| 1 | Loader | |
| 2 | Screen Printer | |
| 3 | Screen Printer with Exchange unit | |
| 4 | Inspection | Option |
| 5 | Dryer | |
| 6 | Buffer system | |
| 7 | Screen Printer | |
| 8 | Screen Printer with Exchange unit | |
| 9 | Inspection | Option |
| 10 | Dryer | |
| 11 | Buffer & Flip system | |
| 12 | Screen Printer | |
| 13 | Screen Printer with Exchange unit | |
| 14 | Inspection | |
| 15 | Buffer system | |
| 16 | Screen Printer | |
| 17 | Screen Printer with Exchange unit | |
| 18 | Inspection | |
| 19 | Firing furmace |
OVERVIEW
50MW LEVEL METALLIZATION LINE POP(PRINT ON PRINT) : SCM-28D
SCM-14RD
| No | Equipmenu | Remark |
|---|---|---|
| 1 | Loader | |
| 2 | Screen Printer | |
| 3 | Dryer | |
| 4 | Unloader |
OVERVIEW
5MW FOR LABORATORY, R & D CENTER AND PILOT LINE POP(PRINT ON PRINT) SUPPLY(OPTION)
Screen Printer (SCSP-14S/SCSP-14D)
| Item | Specifications | Remark |
|---|---|---|
| Model | SCSP14S, SCSP14D* | |
| Substrate | 6 inch Square (156mmx156mm) ±0.5mm | |
| Lane number | 1 Lane / Line | |
| Throughput(TPT) | 1200 cells/hr (1400 cells/hr MAX) | |
| Wafer flow height | 950mm ±15mm (The height is distance from floor to cell flow) | |
| Up Time (%) | ≥ 96% | |
| Breakage rate (%) | ≤ 0.3% | |
| Wafer align accuracy | ±12.5um | |
| FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
OVERVIEW
CONVEYOR UNIT
PRE-ALIGN UNIT
WORK TABLE UNIT
MASK UNIT
SQUEEGEE UNIT
BREAKAGE INSPECTION
Screen Printer (SCSP-28S/SCSP-28D)
| Item | Specifications | Remark |
|---|---|---|
| Model | SCSP28S, SCSP28D* | |
| Substrate | 6 inch Square (156mmx156mm) ±0.5mm | |
| Lane number | 1 Lane / Line | |
| Throughput(TPT) | 1200 cells/hr (1400 cells/hr MAX) | |
| Wafer flow height | 950mm ±15mm (The height is distance from floor to cell flow) | |
| Up Time (%) | ≥ 96% | |
| Breakage rate (%) | ≤ 0.3% | |
| Wafer align accuracy | ±12.5um | |
| FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
OVERVIEW
SCREEN PRINTER (DUAL LANE)
EXCHANGE UNIT
SCREEN PRINTER (DUAL LANE)
Loading System
| Item | Specifications | Remark |
|---|---|---|
| Cassette (TRC) | 100 wafers/cassette Pitch & Row input system | |
| MAX Cassette load | 5ea standard or Customer demand | |
| Cassette Transfer | Motor & Inverter control | |
| Buffer | Loading 10 wafers Unloading when cassette changing | |
| Breakage inspection | 2M px. Detect Size, V-cut and chip. | |
| Dispose of breakage wafers | Stack Reject box | |
| Throughput(TPT) | 1400 cells/hr (Single lane) 2800 cells/hr (Dual lane) |
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| FA | SECS/GEM Support (ex. SECS II, HSMS) | Option |
OVERVIEW
CONVEYOR UNIT / PRE-ALIGN UNIT / WORK TABLE UNIT / MASK UNIT / SQUEEGEE UNIT / BREAKAGE INSPECTION
Buffer/Flip System
| No | Equipmenu | Remark |
|---|---|---|
| 1 | Loader | |
| 2 | Screen Printer | |
| 3 | Inspection | Option |
| 4 | Dryer | |
| 5 | Buffer system | |
| 6 | Screen Printer | |
| 7 | Inspection | Option |
| 8 | Dryer | |
| 9 | Buffer & Flip system | |
| 10 | Screen Printer | |
| 11 | Inspection | |
| 12 | Buffer system | |
| 13 | Screen Printer | |
| 14 | Inspection | |
| 15 | Firing furmace |
COMPOSITION
Breakage inspection Buffer unit Flip station (SCIF only) Divide unit (Dual lane only)
PATTERN INSPECTION SYSTEM (SCPI)
| No | Equipmenu | Remark |
|---|---|---|
| Vision | 11M px. | |
| NG control | Stop & Alarm, Display NG point | |
| Wafer top surface Finger Grid inspection |
Finger grid cut Foreign substance Bus bar position, cut | |
| Wafer bottom surface Bus Bar inspection | Bus bar position, cut Foreign substance | |
| Wafer bottom surface BSF | Printing area Paste pore BSF Scratch | |
| Throughput(TPT) | 1400 cells/hr (Single lane)2800 cells/hr (Dual lane) | |
| FA | SECS/GEM Support (ex. SECS II, HSMS) | option |
COMPOSITION
Conveyor unit Pattern inspection Wafer turn unit (option)
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